DRIE process optimization to achieve high aspect ratio for capacitive MEMS sensors

Date

2015-09-23

Author

Aydemir, Akın
Akın, Tayfun

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This paper focuses on process optimization of deep reactive ion etching (DRIE) to achieve high aspect ratio structures, specifically the fabrication of capacitive sensors. Very high aspect ratios up to 70:1 on trenches of 1.0 µm and have been achieved using the Bosch process by optimizing the process parameters. Effects of the process parameters on the etch rate, profile angle, and selectivity to the masking material are investigated in detail. This approach can be easily integrated on conventional ICP equipment to achieve high aspect ratio structures on any trench dimension.

Subject Keywords

DRIE, High aspect ratio, Process optimization, Silicon etching

URI

https://hdl.handle.net/11511/87028
https://www.researchgate.net/profile/Akin_Aydemir/publication/280728731_DRIE_Process_Optimization_to_Achieve_High_Aspect_Ratio_for_Capacitive_MEMS_Sensors/links/560a4b7108ae1396914bb23a.pdf

Conference Name

MME 2015 :26th Micromechanics and Microsystems Europe workshop

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

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Citation Formats

A. Aydemir and T. Akın, “DRIE process optimization to achieve high aspect ratio for capacitive MEMS sensors,” presented at the MME 2015 :26th Micromechanics and Microsystems Europe workshop, Toledo, Spain, 2015, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/87028.