Characterization of spray cooling for electronic devices

Download
2014
Öksüz, Selçuk
The trends in electronics industry are towards miniaturizing and increasing power needs that result in high heat fluxes. High heat fluxes lead to thermal problems and performance loss in devices. Well known cooling techniques, such as utilization of fans or single phase liquid cooling, have limited cooling capacity. Among two phase cooling methods, spray cooling is one of the best cooling technique. Thus, in this study it is aimed to construct a compact and high performance yet simple experimental setup for a real life application of spray cooling of high heat flux electronic devices.The closed loop system consists of a spraying chamber, a custom made microchannel heat exchanger as a condenser unit, a gear pump and a small filter-reservoir assembly. Dielectric liquid FC-72 is sprayed vertically upward using single pressure atomized nozzle to 20 mm diameter chamber. In these tests, two 10 ohm thick film resistors on a copper block are used to simulate high heat flux boundary condition. Ten different surface arrangements are tested by changing heat flux and volumetric flow rate of the spraying liquid. Experimental results show that at 0.4 liters/min flow rate, 130 W/cm2 maximum heat flux (40.85% enhancement) is achieved with the straight fin surface arrangement.

Suggestions

Development of diffusion bonded materials for electronics cooling applications
Atabay, Sıla Ece; Dericioğlu, Arcan Fehmi; Department of Metallurgical and Materials Engineering (2017)
Failure of most of the electronic systems are originating from deterioration of the components due to excessive heat flux generation. The unstoppable demand for more complex and miniaturized electronic systems makes the development of more suitable and feasible production methods for their cooling systems and components compulsory. In the scope of this study diffusion bonding behavior of the aluminum (Al) 6063 alloy was investigated to make this bonding method and alloy system available for the electronic c...
Numerical investigation of natural convection from inclined plate finned heat sinks
Mehrtash, Mehdi; Tarı, İlker; Department of Mechanical Engineering (2011)
Finned heat sink use for electronics cooling via natural convection is numerically investigated. An experimental study from the literature that is for vertical surfaces is taken as the base case and the experimental setup is numerically modeled using commercial CFD software. The flow and temperature fields are resolved. A scale analysis is applied to produce an order-of-magnitude estimate for maximum convection heat transfer corresponding to the optimum fin spacing. By showing a good agreement of the result...
Implementation of metal-based microchannel heat exchangers in a microrefrigeration cycle, and numerical and experimental investigation of surface roughness effects on flow boiling
Jafari Khousheh Mehr, Rahim; Okutucu Özyurt, Hanife Tuba; Ünver, Hakkı Özgür; Department of Mechanical Engineering (2015)
A microscale vapor compression refrigeration cycle has been constructed for possible application in the thermal management of compact electronic components. The micro-evaporator and micro-condenser components have been fabricated using wire electron discharge machining and micromilling, respectively. Three microevaporators have been manufactured with different surface roughness for the experimental and numerical investigation of roughness effect on nucleate flow boiling in microchannels. In the numerical pa...
Multi-dimensional modelling of evaporation in the micro region of a micro grooved heat pipe
Akkuş, Yiğit; Dursunkaya, Zafer; Tarman, Işık Hakan; Department of Mechanical Engineering (2015)
Capillary cooling devices are preferred in heat removal from electronic components which are characterized by high heat dissipation rates. Heat pipes use various wick structures to generate the necessary capillary action. Heat pipes that use grooved micro-channels as wick structures, have been widely studied by researchers due to the fact that their simple geometry enables the modelling of fluid flow and heat transfer both analytically and numerically. Near the attachment point of liquid-vapor free surface ...
Adaptive controller based on grid impedance estimation for stable operation of grid-connected inverters under weak grid conditions
Temiz, Hakan; Keysan, Ozan; Demirok, Erhan (Institution of Engineering and Technology (IET), 2020-10-01)
An electric grid having high impedance seen from the connection point is considered as a weak grid and it adversely affects the system stability of grid-tied voltage source inverters in renewable power devices. In this study, an adaptive controller is proposed by configuring the settling time of the phase-locked loop based on the estimated grid impedance. Pseudorandom binary sequence injection and Fourier techniques are carried out for grid impedance estimation. Impedance-based stability analysis is perform...
Citation Formats
S. Öksüz, “Characterization of spray cooling for electronic devices,” M.S. - Master of Science, Middle East Technical University, 2014.