Characterization of spray cooling for electronic devices

Öksüz, Selçuk
The trends in electronics industry are towards miniaturizing and increasing power needs that result in high heat fluxes. High heat fluxes lead to thermal problems and performance loss in devices. Well known cooling techniques, such as utilization of fans or single phase liquid cooling, have limited cooling capacity. Among two phase cooling methods, spray cooling is one of the best cooling technique. Thus, in this study it is aimed to construct a compact and high performance yet simple experimental setup for a real life application of spray cooling of high heat flux electronic devices.The closed loop system consists of a spraying chamber, a custom made microchannel heat exchanger as a condenser unit, a gear pump and a small filter-reservoir assembly. Dielectric liquid FC-72 is sprayed vertically upward using single pressure atomized nozzle to 20 mm diameter chamber. In these tests, two 10 ohm thick film resistors on a copper block are used to simulate high heat flux boundary condition. Ten different surface arrangements are tested by changing heat flux and volumetric flow rate of the spraying liquid. Experimental results show that at 0.4 liters/min flow rate, 130 W/cm2 maximum heat flux (40.85% enhancement) is achieved with the straight fin surface arrangement.


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Citation Formats
S. Öksüz, “Characterization of spray cooling for electronic devices,” M.S. - Master of Science, Middle East Technical University, 2014.