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A folded leg Ka-band RF MEMS shunt switch with amorphous silicon (a-Si) sacrificial layer
Date
2017-05-01
Author
Demirel, Kaan
Yazgan, Erdem
Demir, Şimşek
Akın, Tayfun
Metadata
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This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
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Design and fabrication of a folded leg Ka-band RF micro electro mechanical systems (RF MEMS) is presented. The mechanical design is carried out to observe minimum permanent deformation on the MEMS bridge after our in-house MEMS packaging process temperature treatment (200 A degrees C). On the other hand, the actuation voltage is aimed as < 30 V and measured as 24-25 V before thermal treatment. Moreover, the switch shows 28-29 V actuation voltage after thermal treatment. The fabricated switch shows -0.4 dB insertion loss for the up state position at Ka-band, before and after heat treatment. The switch is fabricated on quartz wafer using an in-house surface micromachining process with a new amorphous silicon sacrificial layer structure.
Subject Keywords
Hardware and Architecture
,
Electrical and Electronic Engineering
,
Electronic, Optical and Magnetic Materials
,
Condensed Matter Physics
URI
https://hdl.handle.net/11511/38861
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
DOI
https://doi.org/10.1007/s00542-016-2892-5
Collections
Department of Electrical and Electronics Engineering, Article