A folded leg Ka-band RF MEMS shunt switch with amorphous silicon (a-Si) sacrificial layer

Date

2017-05-01

Author

Demirel, Kaan
Yazgan, Erdem
Demir, Şimşek
Akın, Tayfun

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Design and fabrication of a folded leg Ka-band RF micro electro mechanical systems (RF MEMS) is presented. The mechanical design is carried out to observe minimum permanent deformation on the MEMS bridge after our in-house MEMS packaging process temperature treatment (200 A degrees C). On the other hand, the actuation voltage is aimed as < 30 V and measured as 24-25 V before thermal treatment. Moreover, the switch shows 28-29 V actuation voltage after thermal treatment. The fabricated switch shows -0.4 dB insertion loss for the up state position at Ka-band, before and after heat treatment. The switch is fabricated on quartz wafer using an in-house surface micromachining process with a new amorphous silicon sacrificial layer structure.

Subject Keywords

Hardware and Architecture, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Condensed Matter Physics

URI

https://hdl.handle.net/11511/38861

Journal

MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

DOI

https://doi.org/10.1007/s00542-016-2892-5

Collections

Department of Electrical and Electronics Engineering, Article

Citation Formats

K. Demirel, E. Yazgan, Ş. Demir, and T. Akın, “A folded leg Ka-band RF MEMS shunt switch with amorphous silicon (a-Si) sacrificial layer,” MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, vol. 23, pp. 1191–1200, 2017, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/38861.