Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Open Access Guideline
Open Access Guideline
Postgraduate Thesis Guideline
Postgraduate Thesis Guideline
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
Forced air cooling of CPUs with heat sinks: A numerical study
Date
2008-09-01
Author
Ozturk, Ernre
Tarı, İlker
Metadata
Show full item record
This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
.
Item Usage Stats
104
views
0
downloads
Cite This
A common ATX form factor personal computer system is modeled in detail. The flow and temperature fields inside the chassis are numerically investigated as a conjugate heat transfer problem. The computational effort is concentrated on the forced air cooling of the CPU using a heat sink. Three different commercial heat sink designs are analyzed by using commercial computational fluid dynamics software packages Icepak and Fluent. The grid independent, well converged, and well posed simulations are performed, and the results are compared with the experimental data. It is observed that flow obstructions in the chassis and the resulting air recirculation affect the heat sink temperature distribution. The specific thermal resistance values for the heat sinks are compared. It is observed that although they have different geometries, all of the three heat sinks have similar specific thermal resistances. The best heat sink is selected and modified in order to have a lower maximum temperature distribution in the heat sink by changing the geometry and the material. Especially, replacing aluminum with copper as the heat sink material improved the performance. The importance of modeling the entire chassis is demonstrated by comparing the simulation results with the results from a model of only the CPU-heat-sink-fan assembly.
Subject Keywords
Electrical and Electronic Engineering
,
Electronic, Optical and Magnetic Materials
URI
https://hdl.handle.net/11511/43498
Journal
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
DOI
https://doi.org/10.1109/tcapt.2008.2001840
Collections
Department of Mechanical Engineering, Article
Suggestions
OpenMETU
Core
RC Performance Evaluation of Interconnect Architecture Options Beyond the 10-nm Logic Node
Kıncal, Serkan; Abraham, Mathew C.; Schuegraf, Klaus (Institute of Electrical and Electronics Engineers (IEEE), 2014-06-01)
This paper summarizes the findings of an RC performance modeling approach for evaluating various material and architecture options by which interconnect wires are incorporated onto integrated circuits. For the present dual-damascene structure, the grain boundary and surface scattering modes are identified as the top contributors to resistance degradation, along with the cross-sectional area consumed by the liner/barrier layers. Self-forming barriers, a technology that provides direct Cu-insulator interfaces...
Hybrid connection of RF MEMS and SMT components in an impedance tuner
Unlu, Mehmet; Topalli, Kagan; Atasoy, Halil Ibrahim; Demir, Şimşek; Aydın Çivi, Hatice Özlem; Akın, Tayfun (Elsevier BV, 2010-01-01)
This paper presents a systematic construction of a model for a hybrid connected RF MEMS and SMT components in a reconfigurable impedance tuner. The double stub hybrid impedance tuner which employs a high number of MEMS switches is selected to demonstrate the feasibility of the connections. In the hybrid tuner, MEMS switches are actuated with DC bias signals, where SMT resistors de-couple RF from the DC lines. The hybrid tuner is realized in two steps, where the MEMS impedance tuner is fabricated on a glass ...
An on-die ultra-low voltage DC-DC step-up converter with voltage doubling LC-tank
Jayaweera, H. M. P. C.; Pathirana, W. P. M. R.; Muhtaroglu, Ali (IOP Publishing; 2016-12-01)
In this paper we report the design, characterization and verification of a novel on-die ultra-low voltage DC-DC converter circuit for energy harvester applications in 0.18 mu m complementary metal oxide semiconductor (CMOS) technology. The circuit self-starts, does not use off-chip components, and is thus suitable for use in highly integrated low cost systems. The first version of the design has a five-stage charge-pump stimulated by an oscillator with two center-tap inductors. It is validated on a test chi...
SINGLE-, DUAL-, AND TRIPLE-BAND METAMATERIAL-INSPIRED ELECTRICALLY SMALL PLANAR MAGNETIC DIPOLE ANTENNAS
Turkmen, Oznur; Sayan, Gönül; Ziolkowski, Richard W. (Wiley, 2014-01-01)
The design and performance characteristics of metamaterial-inspired electrically small, single, dual and triple band antennas at the GSM (1.93-1.99 GHz), ISM (2.43-2.4835 GHz), and WiMAX (3.3-3.6 GHz) frequencies are reported. These antennas are based on a coaxially fed printed dipole integrated in a planar configuration with capacitively loaded loops (CLLs) as its near-field resonant parasitic radiators. In the proposed topology, the number of operating frequencies is determined by the number of CLLs. Thes...
Metamaterial absorber-based sensor embedded into X-band waveguide
SABAH, CUMALİ; TURKMEN-KUCUKSARİ, OZNUR; Sayan, Gönül (Institution of Engineering and Technology (IET), 2014-07-17)
A novel metamaterial sensor, integrated with an X-band waveguide, is proposed for high-resolution measurements of variations in the dielectric constant and/or the thickness of a superstrate layer that covers a pair of absorber unit cells. Variations in superstrate parameters are potentially caused by physical, chemical or biological factors, and can be detected by measuring the corresponding shifts in the resonance frequency of the metamaterial sensor. It is estimated by simulation results that resolution l...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
E. Ozturk and İ. Tarı, “Forced air cooling of CPUs with heat sinks: A numerical study,”
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
, pp. 650–660, 2008, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/43498.