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Metallization of high density polyurethane surfaces

Aykaç, Büşra
AElectroplating onto polymeric materials is required for different purposes in various applications. Commercial polyurethanes (PU) are electrically insulator materials and durable at high temperatures. Nevertheless, the PU used in this study has high electrical conductivity, a low thermal expansion coefficient and is a high density foam. In this work, surface metallization of PU foam was studied to prepare the surface for a subsequent electroplating process. The surface metallization was carried out by sensitization, activation and electroless nickel plating. Metallized surfaces were characterized after electrochemical nickel plating at different current densities and surface morphology, roughness as well as physical properties of the coatings. The results show that increasing current density adversely affects the surface morphology and metallization processes enhance the surface conductivity of the foam.