RF Telemetry Powering and Control of Hermetically-Sealed Integrated Sensors and Actuators

Date

2002-08-06

Author

Akın, Tayfun
Najafi, Khalıl

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

48
views

0
downloads

An RF telemetry system for powering and control of microminiature integrated transducers packaged in a hermetically sealed custom-made glass capsule is described. A class-E power amplifier is utilized to energize and control a single-channel microstimulator for neuromuscular applications. The transmitter can deliver 1.5 W of power through a solenoid antenna using a 12-V rechargeable battery, while achieving efficiencies greater than 90%. The microstimulator antenna is a 1.5-mm-diameter, 4-5-mm-long ferrite-cored solenoid coil which can generate peak voltages of up to 50 V, and up to 50 mW of power. A custom-made glass capsule electrostatically bonded to the microstimulator's silicon carrier provides a hermetic package for the implant. Lead transfer into the sealed chamber is achieved using thin films of iridium insulated with low-pressure chemical vapor deposition (LPCVD) thin films. Helium leak tests on these structures show leak rates below 10/sup -9/ cm/sup 3//s.

Subject Keywords

Radio frequency, Telemetry, Hermetic seals, Packaging, Glass, Solenoids, Sputtering, Control systems, Transducers, Power amplifiers

URI

https://hdl.handle.net/11511/45920

DOI

https://doi.org/10.1109/solsen.1990.109840

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

Suggestions

OpenMETU
Core

Packaging of RF MEMS switches and performance improvement Comart, İlker; Demir, Şimşek; Department of Electrical and Electronics Engineering (2019) This dissertation presents a novel zero-level packaging method for shunt, capacitive contact RF MEMS switches where BCB acts as the adhesive interlayer between the cap and device wafers. Initially, the packaging concept is realized for 50 Ω CPW transmission lines. A microwave characterization procedure (circuit modeling) is performed by curve ﬁtting ﬁve packaged CPW transmission line performances to the proposed circuit model. The circuit model consists of cascaded transmission line segments, in which lumpe...
Frequency tunable microstrip patch antenna using RF MEMS technology Erdıl, Emre; Topallı, Kagan; Unlu, Mehmet; Aydın Çivi, Hatice Özlem; Akın, Tayfun (2007-04-01) A novel reconfigurable microstrip patch antenna is presented that is monolithically integrated with RF microelectromechanical systems (MEMS) capacitors for tuning the resonant frequency. Reconfigurability of the operating frequency of the microstrip patch antenna is achieved by loading it with a coplanar waveguide (CPW) stub on which variable MEMS capacitors are placed periodically. MEMS capacitors are implemented with surface micromachining technology, where a 1-mu m thick aluminum structural layer is plac...
Distributed contact flip chip InGaN/GaN blue LED; comparison with conventional LEDs Genc, M.; Sheremet, V.; Elci, M.; KASAPOĞLU, Ahmet Emre; ALTUNTAŞ, İSMAİL; DEMİR, İLKAY; Egin, G.; Islamoglu, S.; Gür, Emre; Muzafferoglu, N.; ELAGÖZ, SEZAİ; GÜLSEREN, Oğuz; AYDINLI, ATİLLA (Elsevier BV, 2019-04-01) This paper presents high performance, GaN/InGaN-based light emitting diodes (LEDs) in three different device configurations, namely Top Emitting (TE) LED, conventional Flip Chip (FC) and Distributed Contact (DC) FC. Series resistances as low as 1.1 Omega have been obtained from FC device configurations with a back reflecting ohmic contact of Ni/Au/RTA/Ni/Ag metal stack. A small shift has been observed between electroluminescence (EL) emissions of TE LED and the FC LEDs. In addition, FWHM value of the EL emi...
Cantilever type radio frequency microelectromechanical systems shunt capacitive switch design and fabrication Demirel, Kaan; Yazgan, Erdem; Demir, Şimşek; Akın, Tayfun (SPIE-Intl Soc Optical Eng, 2015-9-21) A new cantilever type radio frequency microelectromechanical systems (RF MEMS) shunt capacitive switch design and fabrication is presented. The mechanical, electromechanical, and electromagnetic designs are carried out to get <40 V actuation voltage, high isolation, and low insertion loss for 24 and 35 GHz and the fabrication is carried out for 24 GHz RF MEMS switch. The fabricated switch shows lower than 0.35 dB insertion loss up to 40 GHz and greater than 20 dB isolation at 22 to 29 GHz frequency band. An...
Integrated Optical Modulator Based on Transition between Photonic Bands Gövdeli, Alperen; Sarihan, Murat Can; Karaca, Utku; Kocaman, Serdar (Springer Science and Business Media LLC, 2018-01-26) An area efficient novel optical modulator with low operation voltage is designed based on integrated Mach-Zehnder Interferometer with a photonic crystal slab structure as the phase shifter. Plasma dispersion effect is utilized so that photonic band-to-band transition occurs at the operating frequency leading to a high index change (Delta n = similar to 4) for pi-phase shift on the modulator. This approach reduces the phase shifter length to a few micrometers (similar to 5 mu m) in a silicon on insulator pla...

Citation Formats

T. Akın and K. Najafi, “RF Telemetry Powering and Control of Hermetically-Sealed Integrated Sensors and Actuators,” 2002, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/45920.