Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique

Date

2003-01-01

Author

Huang, Y
Haeggstrom, E
Bayram, Barış
Zhuang, X
Ergun, AS
Cheng, CH
Khuri-Yakub, BT

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We report experimental results from collapsed regime operation of capacitive micromachined ultrasonic transducers (cMUTs) fabricated by a wafer bonding technique. The results show that a cMUT operating in the collapsed regime produces a maximal output pressure higher than a cMUT operating in the pre-collapse regime at 90 % of its collapse voltage, 1.79 kPa/V vs. 9.72 kPa/V at 2.3 MHz. In collapsed regime operation the fractional bandwidth (pulse echo) is increased compared to that obtained in pre-collapsed regime operation 140 % vs. 83 % with a bias 90 % of the collapse voltage. Characterization of 1-D cMUT arrays operating in oil was done by ultrasonic pulse echo and pitch catch measurements.

URI

https://hdl.handle.net/11511/53357

Conference Name

IEEE International Ultrasonics Symposium

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Department of Electrical and Electronics Engineering, Conference / Seminar

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Citation Formats

Y. Huang et al., “Collapsed regime operation of capacitive micromachined ultrasonic transducers based on wafer-bonding technique,” presented at the IEEE International Ultrasonics Symposium, Honolulu, HI, 2003, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/53357.