Hybrid Integration of Broadband Silicon Modulators and InGaAs Photodetectors

2018-10-04
Karaca, Utku
Gövdeli, Alperen
Kocaman, Serdar
We present on-chip integration of silicon modulators and InGaAs photodetectors via flip-chip bonding. Modulators fabricated on silicon-on-insulator (SOI) and photodetectors grown on InP wafers were fabricated independently and the hybrid integration was achieved by the deposition of indium (In) bumps on both sides.

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Citation Formats
U. Karaca, A. Gövdeli, and S. Kocaman, “Hybrid Integration of Broadband Silicon Modulators and InGaAs Photodetectors,” 2018, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/54249.