Reliability concerns of lead-free solder use in aerospace applications

Date

2007-06-16

Author

Baylakoglu, Ilknur

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In this paper, it has been provided the impact of lead free solder use in electronics to the aerospace electronics in the aerospace environment. These impacts especially have been faced in the areas of reliability, assembly methods, cost drivers, supply chain management, and alternative materials selection. Reliability will probably be the most significant factor for the aerospace industry if it converts to Pb free. So, the question has been addressed by focusing in the reliability issues in this paper. Some information has been summarized from other studies to give an idea and references.

Subject Keywords

Environmentally friendly manufacturing techniques , Lead, Aerospace materials , Aerospace electronics, Aerospace industry, Materials reliability, Assembly, Costs, Driver circuits , Supply chain management

URI

https://hdl.handle.net/11511/63937

DOI

https://doi.org/10.1109/rast.2007.4283969

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Unclassified, Conference / Seminar

Citation Formats

I. Baylakoglu, “Reliability concerns of lead-free solder use in aerospace applications,” 2007, p. 158, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/63937.