Morphological evolution of edge-hillocks on single-crystal films having anisotropic drift-diffusion under the capillary and electromigration forces

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2007-01-22

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Ogurtani, Tarik Omer
Celik, Aytac
Oren, Ersin Emre

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The morphological evolution of hillocks at the unpassivated sidewalls of single-crystal metallic thin film interconnects is investigated via computer simulations using the free-moving boundary value problem. The effect of drift-diffusion anisotropy on the development of surface topographical scenarios is fully explored under the action of electromigration and capillary forces, utilizing numerous combinations of the surface texture, the drift-diffusion anisotropy and the direction of the applied electric field. The simulation studies yield analytical relationships for the velocity of the surface solitary waves and the drift velocity of electromigration-induced internal voids as a function of the applied current densities, which contain intrinsic and structural properties of the single-crystal thin films. The threshold value of the applied current density, above which electromigration-induced internal voids can be formed and may cause the catastrophic failure of interconnects by breaching, also appears explicitly in this relationship. (c) 2006 Published by Elsevier B.V.

Subject Keywords

Materials Chemistry, Electronic, Optical and Magnetic Materials, Surfaces, Coatings and Films, Surfaces and Interfaces, Metals and Alloys

URI

https://hdl.handle.net/11511/66852

Journal

THIN SOLID FILMS

DOI

https://doi.org/10.1016/j.tsf.2006.08.020

Collections

Department of Metallurgical and Materials Engineering, Article

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Citation Formats

T. O. Ogurtani, A. Celik, and E. E. Oren, “Morphological evolution of edge-hillocks on single-crystal films having anisotropic drift-diffusion under the capillary and electromigration forces,” THIN SOLID FILMS, pp. 2974–2983, 2007, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/66852.