Numerical investigation of forced convection thermal management of high power electronics on a rotary platform

2015-08-12
Anıl, Calıskan
Tarı, İlker
Show full item record
194
views
0
downloads
An package on a rotary platform including two components with 600 W, one component with 350 W and one small component with 70 W heat dissipation rates (1620 W total heat load) is numerically and experimentally investigated under steady state conditions. In order to avoid rotary joints and to reduce the cost, the thermal management solution for the heat dissipation is placed entirely on the rotary platform. The thermal management solution consists of heat sinks attached on vertical side surfaces of the platform. The heat dissipating components are connected to the heat sinks with heat pipes. The heat sinks are covered with cover plates to form flow channels that are used for forced convection heat transfer with the help of high power fan assemblies. The thermal management system is numerically modeled and then the numerical model is validated with the help of a set of experiments. The validated model is used for the optimization of the system. The optimization parameters are the heat pipe locations and their connections to the heat sinks. The optimization parameters are the heat pipe locations, their dimensions, their connections to the heat sinks and fin structures of the heat sinks. The optimization criterion is to maintain nearly uniform temperature distributions on the heat sinks. The constraints are the lengths of the standard heat pipes and the limited options to bend the heat pipes due to their fragile structures. The system can keep the hot spot temperatures below the allowed maximum temperature of 120 °C even for the case of 50 °C ambient air temperature.
Electronics cooling, Forced convection, Rotary platforms, Rotary platforms, Heat sinks, Heat pipes, CFD
https://hdl.handle.net/11511/86638
1st Thermal and Fluid Engineering Summer Conference, TFESC, 2015
Department of Mechanical Engineering, Conference / Seminar

Suggestions

Heat dissipation from electronic packages on rotary platforms with the help of heat pipe networks
Çalışkan, Anıl; Tarı, İlker; Department of Mechanical Engineering (2015)
An electronics package on a rotary platform including two components with 600 W, one component with 350 W and one small component with 70 W heat dissipation rates (1620 W total heat load) is numerically and experimentally investigated under steady state conditions. In order to avoid rotary joints and to reduce the costs of design, maintenance and production, the thermal management solution for the heat dissipation is entirely placed on the rotary platform. The thermal management solution includes heat sinks...
Numerical Simulation of Reciprocating Flow Forced Convection in Two-Dimensional Channels
Sert, Cüneyt (ASME International, 2003-5-20)
<jats:p>Numerical simulations of laminar, forced convection heat transfer for reciprocating, two-dimensional channel flows are performed as a function of the penetration length, Womersley (α) and Prandtl (Pr) numbers. The numerical algorithm is based on a spectral element formulation, which enables high-order spatial resolution with exponential decay of discretization errors, and second-order time-accuracy. Uniform heat flux and constant temperature boundary conditions are imposed on certain regions of the ...
Numerical Investigation on Cooling of Small form Factor Computer Cases
ORHAN, OMER EMRE; Tarı, İlker (2008-11-01)
In this study, cooling of small form factor computers is numerically investigated. The problem is a conjugate heat transfer problem in which ambient air is the final heat transfer medium. In modeling the problem, heat transfer using heat pipes running from the CPU to the heat exchanger in the back end of the chassis, forced convection inside the chassis, ventilation of the chassis air, conduction paths inside the chassis, and natural convection from the chassis walls to the ambient air are considered. The n...
Performance analysis of a solar-assisted heat pump with an evacuated tubular collector for domestic heating
Caglar, Ahmet; Yamali, Cemil (2012-11-01)
Performance of a solar-assisted heat pump with an evacuated tubular collector has been analyzed both theoretically and experimentally. A domestic heating system has been designed, constructed and tested. The evacuated tubular solar collector has been used to achieve higher collector efficiencies. The effects of evaporation temperature on the heating capacity and performance of the system have been investigated. Evaporation temperature varies between 5.2 and 20.7 degrees C while storage tank temperature vari...
Modeling of multidimensional heat transfer in a rectangular grooved heat pipe /
Odabaşı, Gülnihal; Dursunkaya, Zafer; Department of Mechanical Engineering (2014)
Heat pipes are generally preferred for electronics cooling application due to large heat transfer capacity in spite of small size. Micro heat pipes use small channels, whose dimension is on the order of micrometers, to generate necessary capillary action maintaining fluid flow for heat pipe operation. In the present study a flat micro heat pipe with rectangular cross section is analyzed numerically. A simplified axial fluid flow model is utilized to find liquid-vapor interface shape variation along the heat...
Citation Formats
C. Anıl and İ. Tarı, “Numerical investigation of forced convection thermal management of high power electronics on a rotary platform,” New York, USA, 2015, p. 1401, Accessed: 00, 2021. [Online]. Available: https://hdl.handle.net/11511/86638.
METU IIS - Integrated Information Service open@metu.edu.tr