Heat dissipation from electronic packages on rotary platforms with the help of heat pipe networks

Download
index.pdf
2015
Çalışkan, Anıl
Show full item record
235
views
147
downloads
An electronics package on a rotary platform including two components with 600 W, one component with 350 W and one small component with 70 W heat dissipation rates (1620 W total heat load) is numerically and experimentally investigated under steady state conditions. In order to avoid rotary joints and to reduce the costs of design, maintenance and production, the thermal management solution for the heat dissipation is entirely placed on the rotary platform. The thermal management solution includes heat sinks attached to the vertical side surfaces of the platform and heat pipes connected to heat sinks. The heat dissipating components are connected to the heat sinks with heat pipes. The heat sinks are cooled by forced convection with high power fan assemblies. Two different fin configurations are considered. One of them is a pin fin design and the other one is a plate fin covered with duct design. The thermal management systems are numerically modeled and then one of the numerical models is validated with a set of experiments. The validated model is used for the optimization of the system and as a demonstration of feasibility of the heat pipes. The optimization parameters are the heat pipe locations, their connections to the heat sinks and geometrical properties of the heat sinks. The optimization criteria are to maintain nearly uniform temperature distributions on the heat sinks and to keep critical components below their thermal shut-down points. The constraints are the lengths of the standard heat pipes and the limited options to bend the heat pipes due to their fragile structures. The success of the system is that it can keep the hot spot temperatures below the allowed maximum temperature of 120 oC even for the case of 50 °C ambient air temperature. The limitation of 120 oC working temperature comes from the thermal shut-down limits of the components in the electronics package.
Heat pipes., Heat, Electronics, Electronic apparatus and appliances
http://etd.lib.metu.edu.tr/upload/12619358/index.pdf
https://hdl.handle.net/11511/24906
Graduate School of Natural and Applied Sciences, Thesis

Suggestions

Numerical investigation of forced convection thermal management of high power electronics on a rotary platform
Anıl, Calıskan; Tarı, İlker (null; 2015-08-12)
An package on a rotary platform including two components with 600 W, one component with 350 W and one small component with 70 W heat dissipation rates (1620 W total heat load) is numerically and experimentally investigated under steady state conditions. In order to avoid rotary joints and to reduce the cost, the thermal management solution for the heat dissipation is placed entirely on the rotary platform. The thermal management solution consists of heat sinks attached on vertical side surfaces of the platf...
Implementation of metal-based microchannel heat exchangers in a microrefrigeration cycle, and numerical and experimental investigation of surface roughness effects on flow boiling
Jafari Khousheh Mehr, Rahim; Okutucu Özyurt, Hanife Tuba; Ünver, Hakkı Özgür; Department of Mechanical Engineering (2015)
A microscale vapor compression refrigeration cycle has been constructed for possible application in the thermal management of compact electronic components. The micro-evaporator and micro-condenser components have been fabricated using wire electron discharge machining and micromilling, respectively. Three microevaporators have been manufactured with different surface roughness for the experimental and numerical investigation of roughness effect on nucleate flow boiling in microchannels. In the numerical pa...
Numerical investigation of natural convection from inclined plate finned heat sinks
Mehrtash, Mehdi; Tarı, İlker; Department of Mechanical Engineering (2011)
Finned heat sink use for electronics cooling via natural convection is numerically investigated. An experimental study from the literature that is for vertical surfaces is taken as the base case and the experimental setup is numerically modeled using commercial CFD software. The flow and temperature fields are resolved. A scale analysis is applied to produce an order-of-magnitude estimate for maximum convection heat transfer corresponding to the optimum fin spacing. By showing a good agreement of the result...
Performance analysis of a solar-assisted heat pump with an evacuated tubular collector for domestic heating
Caglar, Ahmet; Yamali, Cemil (2012-11-01)
Performance of a solar-assisted heat pump with an evacuated tubular collector has been analyzed both theoretically and experimentally. A domestic heating system has been designed, constructed and tested. The evacuated tubular solar collector has been used to achieve higher collector efficiencies. The effects of evaporation temperature on the heating capacity and performance of the system have been investigated. Evaporation temperature varies between 5.2 and 20.7 degrees C while storage tank temperature vari...
Multi-dimensional modelling of evaporation in the micro region of a micro grooved heat pipe
Akkuş, Yiğit; Dursunkaya, Zafer; Tarman, Işık Hakan; Department of Mechanical Engineering (2015)
Capillary cooling devices are preferred in heat removal from electronic components which are characterized by high heat dissipation rates. Heat pipes use various wick structures to generate the necessary capillary action. Heat pipes that use grooved micro-channels as wick structures, have been widely studied by researchers due to the fact that their simple geometry enables the modelling of fluid flow and heat transfer both analytically and numerically. Near the attachment point of liquid-vapor free surface ...
Citation Formats
A. Çalışkan, “Heat dissipation from electronic packages on rotary platforms with the help of heat pipe networks,” M.S. - Master of Science, Middle East Technical University, 2015.
METU IIS - Integrated Information Service open@metu.edu.tr