Conduction based compact thermal modeling for thermal analysis of electronic components

Download

index.pdf

Date

2010

Author

Ocak, Mustafa

Metadata

Show full item record

Item Usage Stats

388
views

190
downloads

Conduction based compact thermal modeling of DC/DC converters, which are electronic components commonly used in military applications, are investigated. Three carefully designed numerical case studies are carried out at component, board and system levels using ICEPAK software. Experiments are conducted to gather temperature data that can be used to study compact thermal models (CTMs) with different levels of simplification. In the first (component level) problem a series of conduction based CTMs are generated and used to study the thermal behavior of a Thin-Shrink Small Outline Package (TSSOP) type DC/DC converter under free convection conditions. In the second (board level) case study, CTM alternatives are produced and investigated for module type DC/DC converter components using a printed circuit board (PCB) of an electro-optic system. In the last case study, performance of the CTM alternatives generated for the first case are assessed at the system level using them on a PCB placed inside a realistic avionic box. v Detailed comparison of accuracy of simulations obtained using CTMs with various levels of simplification is made based on experimentally obtained temperature data. Effects of grid size and quality, choice of turbulence modeling and space discretization schemes on numerical solutions are discussed in detail. It is seen that simulations provide results that are in agreement with measurements when appropriate CTMs are used. It is also showed that remarkable reductions in modeling and simulation times can be achieved by the use of CTMs, especially in system level analysis.

Subject Keywords

Mechanical engineering.

URI

http://etd.lib.metu.edu.tr/upload/12612100/index.pdf
https://hdl.handle.net/11511/19541

Collections

Graduate School of Natural and Applied Sciences, Thesis

Suggestions

OpenMETU
Core

Optomechanical analysis and experimental validation of bonding based prism and mirror mounts in a laser system Ünal, Uğur; Balkan, Raif Tuna; Department of Mechanical Engineering (2012) In this thesis, different optomechanical design and adhesive configurations for mounting mirrors and prisms used in a laser system are investigated. Maintaining stability and strength of optical components of a laser device is difficult especially if the system is to be used in military environment. In order to determine the strength of prism mounts to high acceleration levels, mathematical correlations derived by Yoder are used. By use of these mathematical correlations, safety factor of different prism mo...
Numerical simulation and analytical optimization of microchannel heat sinks Türkakar, Göker; Okutucu Özyurt, Hanife Tuba; Department of Mechanical Engineering (2010) This study has two main objectives: The performance evaluation of existing microchannel heat sinks using a CFD model, and the dimensional optimization of various heat sinks by minimizing the total thermal resistance. For the analyses, the geometric modeling is performed using the software GAMBIT while the thermal analysis is performed with FLUENT. The developed model compares very well with those available in the literature. Eight different metal-polymer microchannel heat sinks are analyzed using the model ...
Mixed-mode fracture analysis of orthotropic functionally graded materials Sarıkaya, Duygu; Dağ, Serkan; Department of Mechanical Engineering (2005) Functionally graded materials processed by the thermal spray techniques such as electron beam physical vapor deposition and plasma spray forming are known to have an orthotropic structure with reduced mechanical properties. Debonding related failures in these types of material systems occur due to embedded cracks that are perpendicular to the direction of the material property gradation. These cracks are inherently under mixed-mode loading and fracture analysis requires the extraction of the modes I and II ...
Numerical analysis of ablation process on a two dimensional external surface Aykan, Fatma Serap; Dursunkaya, Zafer; Department of Mechanical Engineering (2005) The thermal response analysis of an ablative material on a two dimensional external surface is performed. The method is applied to both rectangular and cylindrical coordinate systems, where rectangular coordinate system is used for comparison with results available in literature. The current study solves the decomposition of the material at high temperatures by using the nth order Arrhenius equation but excludes the removal of char from the surface due to mechanical erosion or phase change and considers tha...
An experimental study on single crystal diamond turning of optical quality silicon Çalı, Serdal; Gökler, Mustafa İlhan; Department of Mechanical Engineering (2008) Silicon is commonly used in infrared (IR) imaging systems. The surface quality is an important issue in optics manufacturing since surface roughness affects optical performance of imaging systems. Surface quality of an optical component is determined by number of factor, including cutting parameters; cutting speed, depth of cut and feed in radial direction. In this thesis, an experimental study has been performed to investigate the relation between cutting parameters and average roughness of the surface of ...

Citation Formats

M. Ocak, “Conduction based compact thermal modeling for thermal analysis of electronic components,” M.S. - Master of Science, Middle East Technical University, 2010.