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An experimental study on single crystal diamond turning of optical quality silicon

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2008
Çalı, Serdal
Silicon is commonly used in infrared (IR) imaging systems. The surface quality is an important issue in optics manufacturing since surface roughness affects optical performance of imaging systems. Surface quality of an optical component is determined by number of factor, including cutting parameters; cutting speed, depth of cut and feed in radial direction. In this thesis, an experimental study has been performed to investigate the relation between cutting parameters and average roughness of the surface of silicon. In the experiments, silicon specimens, which have a diameter of 50 mm, were face turned by using a 2-axis CNC single point diamond turning machine. The specimens were machined by using either constant spindle speed or constant cutting speed. Two different tools with rake angles of -15 degrees and -25 degrees were used. The attained surfaces were measured by using a white light interferometer, which has a resolution of 0.1nm. The experiments were designed according to the “factorial design” method, considering cutting parameters. The effects of cutting parameters and tool rake angles on surface quality of silicon were observed. The best average surface roughness obtained was about 1 nm which is quite better than the acceptable average surface roughness level of 25 nm.