Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration

Date

2019-10-30

Author

Soydan, Alper Kaan
Yüksel, Mehmet Berat
Işık Akçakaya, Dilek
Külah, Haluk

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

196
views

0
downloads

In this study, development of a wafer level, void free TSV fabrication process flow and feasibility study of TSV integration to MEMS piezoelectric resonator devices have been presented. TSV structures with 100 mu m diameter and 350 mu m depth were copper filled with via sealing and bottom-up electroplating process which is a two-step technique. Four-point Kelvin measurements showed 0.8 m Omega TSV resistance on fabricated TSVs. Furthermore, TSV frames were epoxy bonded to MEMS acoustic transducers, which showed 90% to the resonator signal from the TSV.

Subject Keywords

Through silicon via, Electroplating, MEMS resonator, Kelvin measurement, Cochlear implant

URI

https://hdl.handle.net/11511/33150

DOI

https://doi.org/10.1109/sensors43011.2019.8956828

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

Suggestions

OpenMETU
Core

Modeling and fabrication of electrostatically actuated diaphragms for on-chip valving of MEMS-compatible microfluidic systems Atik, Ali Can; Ozkan, Metin Dundar; Ozgur, Ebru; Külah, Haluk; Yıldırım, Ender (IOP Publishing, 2020-11-01) This paper presents an analytical model to estimate the actuation potential of an electrostatic parylene-C diaphragm, processed on a glass wafer using standard microelectromechanical systems (MEMS) process technology, and integrable to polydimethylsiloxane (PDMS) based lab-on-a-chip systems to construct a normally-closed microvalve for flow manipulation. The accurate estimation of the pull-in voltage of the diaphragm is critical to preserve the feasibility of integration. Thus, we introduced an analytical m...
Design, fabrication, and characterization of micro thermal actuators Gülcüler, Buğrahan; Azgın, Kıvanç; Department of Mechanical Engineering (2020-11) This thesis presents the design, fabrication, and characterization of V-Type thermal actuators, which will be used in an actuator system that is planned to be a tensile and compressive test setup to characterize the expandible cells by the help of double- ended tuning fork resonators as a force sensing mechanism. Actuators are serially packed to increase the generated force by them while maintaining the same deflection values. They have been connected to the overall system by springs to create a force on te...
System integration of MEMS devices on flexible substrate for fully implantable cochlear implant applications Soydan, Alper Kaan; Külah, Haluk; Department of Micro and Nanotechnology (2019) This master thesis is a result of multidisciplinary research bringing together concepts in electronics engineering, implant technologies, materials science, microfabrication, and device physics. Advancements in healthcare technology and in-vivo implants, electronic devices implemented on flexible substrates are highly demanded in the near future. In order to create a physically flexible device which consists of rigid sub-systems serving distinct purposes and made up of varying types of materials, we need re...
Analysis and Elimination of the Capacitive Feedthrough Current on Electrostatically Actuated and Sensed Resonance-Based MEMS Sensors Kangul, Mustafa; Aydin, Eren; Gokce, Furkan; Zorlu, Ozge; Külah, Haluk (2017-12-01) This paper presents the investigation of two different capacitive feedthrough current elimination methods with an analysis of the effect of the capacitive feedthrough current on the resonance characteristics of electrostatically actuated and sensed resonant MEMS sensors. Electrostatically actuated and sensed resonators have various applications, such as accelerometers, gyroscopes, mass sensors, and temperature sensors. In most of these applications, as sensitivity increases, gain decreases. The capacitive f...
Fabrication of a Three-Axis Capacitive MEMS Accelerometer on a Single Substrate Aydemir, Akin; Akın, Tayfun (2015-11-04) This paper presents a new fabrication approach and a design for the fabrication of a three-axis capacitive MEMS accelerometer where differential sensing is enabled for all sense directions. In this approach, individual lateral and vertical axis accelerometers are fabricated in the same die on an SOI wafer which is eutectically bonded to a glass substrate. Differential sensing for the vertical axis accelerometer is realized by defining the proof mass of the accelerometer on the structural layer of the SOI wa...

Citation Formats

A. K. Soydan, M. B. Yüksel, D. Işık Akçakaya, and H. Külah, “Fabrication and Feasibility of Through Silicon Via for 3D MEMS Resonator Integration,” 2019, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/33150.