Modeling and fabrication of electrostatically actuated diaphragms for on-chip valving of MEMS-compatible microfluidic systems

2020-11-01
Atik, Ali Can
Ozkan, Metin Dundar
Ozgur, Ebru
Külah, Haluk
Yıldırım, Ender
Show full item record
Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
323
views
3206
downloads
This paper presents an analytical model to estimate the actuation potential of an electrostatic parylene-C diaphragm, processed on a glass wafer using standard microelectromechanical systems (MEMS) process technology, and integrable to polydimethylsiloxane (PDMS) based lab-on-a-chip systems to construct a normally-closed microvalve for flow manipulation. The accurate estimation of the pull-in voltage of the diaphragm is critical to preserve the feasibility of integration. Thus, we introduced an analytical model, in a good agreement with the finite element method (FEM), to extend the solution of the pull-in instability by including the effect of nonlinear stretching for multilayered circular diaphragms. We characterized the operation of fabricated diaphragms with a 300 mu m radius for the parameters, including pull-in voltage (221 V on average), opening and closing response times (in microseconds), repeatability (more than 50 times), and touch area (25.3% +/- 2.6% at pull-in potential). The experimental pull-in voltage shows close accuracy with the predicted results. Moreover, the diaphragm, sealed with a PDMS microchannel, was tested under fluid flow to prove the applicability of microfluidic integration. The hybrid fabrication method enables the realization of optically transparent and durable electrostatic microvalves for complex functioning of polymer-based microfluidic systems, as the extended analytical formulation permits accurate modeling of operation.
Mechanical Engineering, Electrical and Electronic Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials, Circular diaphragm, Electrostatic actuation, Microvalve, MEMS
https://hdl.handle.net/11511/42060
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Department of Electrical and Electronics Engineering, Article

Suggestions

An on-die ultra-low voltage DC-DC step-up converter with voltage doubling LC-tank
Jayaweera, H. M. P. C.; Pathirana, W. P. M. R.; Muhtaroglu, Ali (IOP Publishing; 2016-12-01)
In this paper we report the design, characterization and verification of a novel on-die ultra-low voltage DC-DC converter circuit for energy harvester applications in 0.18 mu m complementary metal oxide semiconductor (CMOS) technology. The circuit self-starts, does not use off-chip components, and is thus suitable for use in highly integrated low cost systems. The first version of the design has a five-stage charge-pump stimulated by an oscillator with two center-tap inductors. It is validated on a test chi...
Design and fabrication of a high performance resonant MEMS temperature sensor
Kose, Talha; Azgın, Kıvanç; Akın, Tayfun (IOP Publishing, 2016-04-01)
This paper presents a high performance MEMS temperature sensor comprised of a double-ended-tuning-fork (DETF) resonator and strain-amplifying beam structure. The temperature detection is based on the 'thermal strain induced frequency variations' of the DETF resonator. The major source of thermal strain leading to the frequency shifts is the difference in thermal expansion coefficients of the substrate and the device layers of the fabricated structures. By selecting the substrate as glass and the device laye...
Custom integrated circuit design for ultrasonic therapeutic CMUT array
Maadi, Mohammad; Bayram, Barış (Springer Science and Business Media LLC, 2015-04-01)
This paper presents the design of a highly flexible and programmable transmit beam-former ASIC using a high voltage (HV) 0.35 mu m CMOS technology to be flip-chip bonded to a 4 x 4 CMUT array for ultrasound therapeutic applications. However, proposed IC can be used as a transmitter circuitry in color Doppler 3D imaging applications. In our proposed chip, each CMUT element is provided by an 8-bit shift register, an 8-bit comparator, a one-shot circuit with adjustable pulse width, a programmable pulse train g...
A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process
Torunbalci, Mustafa Mert; Alper, Said Emre; Akın, Tayfun (IOP Publishing, 2015-12-01)
This paper presents a novel, inherently simple, and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where a single SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a single glass cap wafer is used for hermetic encapsulation and routing metallization. Hermetic encapsulation can be achieved either with the silicon-glass anodic or Au-Si eutectic bonding techniques. The dies sealed with anodic and Au-Si eutectic bonding provide a...
Fabrication of SiO2-stacked diamond membranes and their characteristics for microelectromechanical applications
Bayram, Barış (Elsevier BV, 2011-04-01)
Diamond is a promising microelectromechanical systems (MEMS) material due to its high Young's Modulus and very large thermal conductivity. In this work, ultrananocrystalline diamond was stacked between silicon dioxide to form thermally-stable and robust membranes. These SiO2-stacked diamond layers were processed into MEMS-compatible membranes. For comparison, membranes composed of only SiO2 were fabricated as well. The structural characteristics of these membranes are compared and analyzed for membranes of ...
Citation Formats
A. C. Atik, M. D. Ozkan, E. Ozgur, H. Külah, and E. Yıldırım, “Modeling and fabrication of electrostatically actuated diaphragms for on-chip valving of MEMS-compatible microfluidic systems,” JOURNAL OF MICROMECHANICS AND MICROENGINEERING, pp. 0–0, 2020, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/42060.
METU IIS - Integrated Information Service open@metu.edu.tr