Fabrication of a Three-Axis Capacitive MEMS Accelerometer on a Single Substrate

2015-11-04
Aydemir, Akin
Akın, Tayfun
This paper presents a new fabrication approach and a design for the fabrication of a three-axis capacitive MEMS accelerometer where differential sensing is enabled for all sense directions. In this approach, individual lateral and vertical axis accelerometers are fabricated in the same die on an SOI wafer which is eutectically bonded to a glass substrate. Differential sensing for the vertical axis accelerometer is realized by defining the proof mass of the accelerometer on the structural layer of the SOI wafer that is sandwiched between two stationary electrodes defined on the glass substrate and the handle layer of the SOI wafer.

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Citation Formats
A. Aydemir and T. Akın, “Fabrication of a Three-Axis Capacitive MEMS Accelerometer on a Single Substrate,” 2015, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/54542.