A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process

2014-09-10
Torunbalci, Mustafa Mert
Alper, Said Emre
Akın, Tayfun
This paper presents a new method for wafer level vacuum packaging of MEMS devices using anodic bonding together with vertical feedthroughs formed on an SOI cap wafer, eliminating the need for any sealing material or any complex via-refill or trench-refill vertical feedthrough steps. The packaging yield is experimentally verified to be above 95%, and the cavity pressure is characterized to be as low as 1 mTorr with the help of a thin-film getter. The shear strength of several packages is measured to be above 15MPa.

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Citation Formats
M. M. Torunbalci, S. E. Alper, and T. Akın, “A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process,” 2014, vol. 87, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/34890.