THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS

Date

2015-06-25

Author

Torunbalci, M. M.
Alper, S. E.
Akın, Tayfun

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This paper presents a novel, inherently simple and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where an SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a glass cap wafer is used for hermetic encapsulation and routing metallization. Glass-to-silicon anodically bonded seals yield a very stable cavity pressure of 150 mTorr after 15 days. The shear strength of the fabricated packages is above 7 MPa. Temperature cycling and ultra-high temperature shock tests results in no degradation in the hermeticity of the packaged chips.

Subject Keywords

Advanced MEMS (aMEMS) process, Wafer level hermetic encapsulation, Vertical feedthroughs, Anodic bonding

URI

https://hdl.handle.net/11511/53308

Conference Name

18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

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Citation Formats

M. M. Torunbalci, S. E. Alper, and T. Akın, “THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS,” presented at the 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Anchorage, AK, 2015, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/53308.