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Device application of AgGa0.5In0.5Se2 thin films deposited by thermal sequential stacked layer method
Date
2014-12-01
Author
COŞKUN, EMRE
Gullu, H. H.
Parlak, Mehmet
Metadata
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An In/n-AgGa0.5In0.5Se2/p-Si/Al heterostructure was produced by thermal sequential stacked layer deposition method and the device characteristics were investigated. The compositional analysis showed that the depositions of the intended stoichiometric composition of AgGa0.5In0.5Se2 structure were obtainable by controlling and providing the necessary deposition conditions during the deposition processes. By means of the room temperature Hall effect and transmission measurements, the carrier concentration and optical band gap values were determined as 9 x 10(15) cm(-3) and 1.65 eV, respectively. In addition, temperature- dependent current-voltage (I-V) and the room temperature capacitance-voltage (C-V) measurements of this heterostructure were carried out. The rectification factor was obtained as about 10(4) at 1.20V for all sample temperatures. Depending on the change in the temperature, the series and shunt resistances were calculated as 10(1) and 10(6) Omega, respectively. The studies on the current transport mechanisms showed that there were two different mechanisms at two different voltage regions: tunneling enhanced recombination mechanism in the voltage range of 0.08 and 0.30V and the space charge limited current mechanism in the voltage range of 0.30 and 0.60 V. The barrier height, built-in potential and interface states density of the deposited heterostructure were also calculated and discussed.
Subject Keywords
Electronic, Optical and Magnetic Materials
,
Surfaces, Coatings and Films
,
Polymers and Plastics
,
Metals and Alloys
,
Biomaterials
URI
https://hdl.handle.net/11511/37929
Journal
MATERIALS RESEARCH EXPRESS
DOI
https://doi.org/10.1088/2053-1591/1/4/046407
Collections
Department of Physics, Article
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E. COŞKUN, H. H. Gullu, and M. Parlak, “Device application of AgGa0.5In0.5Se2 thin films deposited by thermal sequential stacked layer method,”
MATERIALS RESEARCH EXPRESS
, pp. 0–0, 2014, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/37929.