A single-crystal silicon symmetrical and decoupled MEMS gyroscope on an insulating substrate

Date

2005-08-01

Author

Alper, Said Emre
Akın, Tayfun

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This paper presents a single-crystal silicon symmetrical and decoupled (SYMDEC) gyroscope implemented using the dissolved wafer microelectromechanical systems (MEMS) process on an insulating substrate. The symmetric structure allows matched resonant frequencies for the drive and sense vibration modes for high-rate sensitivity and low temperature-dependent drift, while the decoupled drive and sense modes prevents unstable operation due to mechanical coupling, achieving low bias-drift. The 12-15-mu m-thick single-crystal silicon structural layer with an aspect ratio of about 10 using DRIE patterning provides a high sense capacitance of 130 IF, while the insulating substrate provides a low parasitic capacitance of only 20 IF. A capacitive interface circuit fabricated in a 0.8-mu m CMOS process and having a sensitivity of 33 mV/fF is hybrid connected to the gyroscope. Drive and sense mode resonance frequencies of the gyroscope are measured to be 40.65 and 41.25 kHz, respectively, and their measured variations with temperature are +18.28 Hz/ degrees C and +18.32 Hz/ degrees C, respectively, in -40 degrees C to +85 degrees C temperature range. Initial tests show a rate resolution around 0.56 deg/s with slightly mismatched modes, which reveal that the gyroscope can provide a rate resolution of 0.030 deg/s in 50-Hz bandwidth at atmospheric pressure and 0.017 deg/s in 50-Hz bandwidth at vacuum operation with matched modes.

Subject Keywords

Capacitive interface, Decoupled gyroscope, Dissolved wafer process, MEMS gyroscope

URI

https://hdl.handle.net/11511/46212

Journal

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

DOI

https://doi.org/10.1009/jmems.2005.845400

Collections

Department of Electrical and Electronics Engineering, Article

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Citation Formats

S. E. Alper and T. Akın, “A single-crystal silicon symmetrical and decoupled MEMS gyroscope on an insulating substrate,” JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, pp. 707–717, 2005, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/46212.