A simple out of plane capacitive MEMS accelerometer utilizing lateral and vertical electrodes for differential sensing

Terzioglu, Yunus
Kose, Talha
Azgın, Kıvanç
Akın, Tayfun
This paper presents an out-of-plane (z-axis) accelerometer, which incorporates the use of two different MEMS capacitive electrode structures in combination for implementing a linear closed-loop system. During the implementation, the complexity of the design and fabrication steps of the sensing element is kept at a minimum. The proposed accelerometer uses capacitive MEMS sensing element fabricated with a 4-mask process. This sensing element includes a comb finger type lateral electrode and a vertical parallel plate electrode placed beneath the proof mass. During the closed-loop operation, the proof mass is electrostatically pulled down towards the substrate so that the lateral comb electrode can be used as a varying overlap type capacitor. Thus, the bottom and the comb electrodes form a "hybrid" differential capacitor pair, which is suitable to use with a closed-loop, force rebalancing readout circuit such as in [1], and acceleration can be sensed linearly in z-axis with low zero-g offset.


A Capacitive MEMS Accelerometer Readout with Concurrent Detection and Feedback Using Discrete Components
Terzioglu, Yunus; Alper, Said Emre; Azgın, Kıvanç; Akın, Tayfun (2014-05-08)
This paper presents an analog readout method for capacitive MEMS accelerometers in which the feedback actuation and capacitive detection are achieved simultaneously on the same electrode set. The presented circuit operates in closed-loop for improved linearity, and it is constructed in a hybrid platform package in which off-the-shelf discrete components are used together with the silicon-on-glass micro-accelerometer. The system is developed as a practical solution to reduce the complexity of the readout cir...
A current mirroring integration based readout circuit for high performance infrared FPA applications
Külah, Haluk; Akın, Tayfun (2003-04-01)
This paper reports a current mirroring integration (CMI) CMOS readout circuit for high-resolution infrared focal plane array (FPA) applications. The circuit uses a feedback structure with current mirrors to provide stable bias voltage across the photodetector diode, while mirroring the diode current to an integration capacitor. The integration capacitor can be placed outside of the unit pixel, reducing the pixel area and allowing to integrate the current on larger capacitance for larger charge storage capac...
A new design and a fabrication approach to realize a high performance three axes capacitive MEMS accelerometer
Aydemir, Akin; Terzioglu, Yunus; Akın, Tayfun (2016-06-15)
This paper presents a new fabrication approach and design for a three axis capacitive MEMS accelerometer that is capable of measuring externally applied accelerations in three orthogonal axes. Individual lateral and vertical axis accelerometers are fabricated in the same die on an SOI wafer which is anodically bonded to a glass substrate. Handle layer of the SOI wafer is used as the top electrode for the vertical axis accelerometer. This accelerometer has a 2 mm(2) perforated electrode area anchored to the ...
A single-crystal silicon symmetrical and decoupled MEMS gyroscope on an insulating substrate
Alper, Said Emre; Akın, Tayfun (2005-08-01)
This paper presents a single-crystal silicon symmetrical and decoupled (SYMDEC) gyroscope implemented using the dissolved wafer microelectromechanical systems (MEMS) process on an insulating substrate. The symmetric structure allows matched resonant frequencies for the drive and sense vibration modes for high-rate sensitivity and low temperature-dependent drift, while the decoupled drive and sense modes prevents unstable operation due to mechanical coupling, achieving low bias-drift. The 12-15-mu m-thick si...
A Bulk-Micromachined Three-Axis Capacitive MEMS Accelerometer on a Single Die
TEZ, SERDAR; Aykutlu, Ulas; Torunbalci, Mustafa Mert; Akın, Tayfun (2015-10-01)
This paper presents a high-performance three-axis capacitive microelectromechanical system (MEMS) accelerometer implemented by fabricating individual lateral and vertical differential accelerometers in the same die. The fabrication process is based on the formation of a glass-silicon-glass multi-stack. First, a 35-mu m thick < 111 > silicon structural layer of an Silicon-On-Insulator (SOI) wafer is patterned with deep reactive ion etching (DRIE) and attached on a base glass substrate with anodic bonding, wh...
Citation Formats
Y. Terzioglu, T. Kose, K. Azgın, and T. Akın, “A simple out of plane capacitive MEMS accelerometer utilizing lateral and vertical electrodes for differential sensing,” 2015, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/40404.