A parylene coating based room temperature wafer-level attachment method for MEMS integration with zero applied force

Beker, Levent
Zorlu, Ozge
Külah, Haluk
This paper reports a wafer-level attachment method using parylene as an interlayer material for integrating various shaped and fragile substrates into MEMS processes. In the proposed method, the substrates are placed on a handle wafer containing pillars and perforations, and coated with a standard parylene deposition process realized at room temperature, with no applied force. The substrate and the handle wafer are attached to each other via formation of a parylene interlayer. Only poor attachment is observed by utilizing a handle wafer containing pillars alone, as parylene cannot perfectly penetrate through the structures. The parylene penetration is significantly improved by introducing perforations to the handle wafer. It is experimentally shown that, with a perforated handle wafer containing pillar structures having 20 mu m height and 4.5 mm spacing, parylene completely fills the gap between the structures, and can successfully be used to attach substrates to each other. The shear strength between the attached substrates has been measured as 0.49 MPa, proving the feasibility of the method for integrating various materials into MEMS processes. As a demonstrator for the utilization of the attachment method in the microfabrication processes of sensors and actuators, a fragile 7 cm x 7 cm x 190 mu m PZT sheet has been attached to a handle wafer and processed successfully through a sample set of standard MEMS processes.


Beker, Levent; Zorlu, Ozge; Külah, Haluk (2013-01-24)
This paper presents a wafer level attachment method for handling various shaped structures for MEMS processes, using parylene as an interlayer material. In this method, a handle wafer containing pillars and perforations is utilized, and structures are attached to the handle wafer through a parylene coating process realized at room temperature with no applied force. It is observed that pillars with 20 mu m height, 2.5 mm side length, and 4.5 mm spacing can successfully be used to attach two 4 '' substrates t...
Gokce, Furkan; Aydın, Eren; Kangül, Mustafa; Toral, Taylan B.; Zorlu, Ozge; Sardan-Sukas, Ozlem; Külah, Haluk (2017-06-22)
In this study, a fabrication method utilizing parylene bonding for gravimetric resonant based mass sensors is presented. First, parylene bonding was experimentally tested and compared with the literature. Average shear strength was measured as 16.3 MPa (sigma=3MPa). Then, resonators located on top of a microchannel for real-time detection were fabricated using the presented method. Simulations and experiments verify proper operation of the fabricated resonators, and the applicability of the method for fabri...
A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process
Torunbalci, Mustafa Mert; Alper, Said Emre; Akın, Tayfun (2014-09-10)
This paper presents a new method for wafer level vacuum packaging of MEMS devices using anodic bonding together with vertical feedthroughs formed on an SOI cap wafer, eliminating the need for any sealing material or any complex via-refill or trench-refill vertical feedthrough steps. The packaging yield is experimentally verified to be above 95%, and the cavity pressure is characterized to be as low as 1 mTorr with the help of a thin-film getter. The shear strength of several packages is measured to be above...
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Yilmaz, G.; Çiftlik, A.T.; Külah, Haluk (2009-12-14)
This paper presents the design and implementation of a novel dielectrophoresis (DEP) system with spiral channels and concentric electrodes for high resolution cell separation applications. The device is fabricated with a 4 mask parylene process and the design is optimized in MATLAB Simulink reg to confine the operation. Tests with micro particles of different sizes are performed to show size-based separation by dielectrophoresis. Proposed device is also tested with K562 leukemia cell lines to prove that the...
Citation Formats
L. Beker, O. Zorlu, and H. Külah, “A parylene coating based room temperature wafer-level attachment method for MEMS integration with zero applied force,” SENSORS AND ACTUATORS A-PHYSICAL, pp. 1–7, 2014, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/46691.