Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Open Access Guideline
Open Access Guideline
Postgraduate Thesis Guideline
Postgraduate Thesis Guideline
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION
Date
2013-01-24
Author
Beker, Levent
Zorlu, Ozge
Külah, Haluk
Metadata
Show full item record
This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
.
Item Usage Stats
142
views
0
downloads
Cite This
This paper presents a wafer level attachment method for handling various shaped structures for MEMS processes, using parylene as an interlayer material. In this method, a handle wafer containing pillars and perforations is utilized, and structures are attached to the handle wafer through a parylene coating process realized at room temperature with no applied force. It is observed that pillars with 20 mu m height, 2.5 mm side length, and 4.5 mm spacing can successfully be used to attach two 4 '' substrates to each other. The shear strength between the attached substrates is measured as 0.49 MPa, proving the feasibility of the method for integrating various materials into MEMS processes.
URI
https://hdl.handle.net/11511/55368
Collections
Department of Electrical and Electronics Engineering, Conference / Seminar
Suggestions
OpenMETU
Core
A parylene coating based room temperature wafer-level attachment method for MEMS integration with zero applied force
Beker, Levent; Zorlu, Ozge; Külah, Haluk (2014-08-15)
This paper reports a wafer-level attachment method using parylene as an interlayer material for integrating various shaped and fragile substrates into MEMS processes. In the proposed method, the substrates are placed on a handle wafer containing pillars and perforations, and coated with a standard parylene deposition process realized at room temperature, with no applied force. The substrate and the handle wafer are attached to each other via formation of a parylene interlayer. Only poor attachment is observ...
A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process
Torunbalci, Mustafa Mert; Alper, Said Emre; Akın, Tayfun (IOP Publishing, 2015-12-01)
This paper presents a novel, inherently simple, and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where a single SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a single glass cap wafer is used for hermetic encapsulation and routing metallization. Hermetic encapsulation can be achieved either with the silicon-glass anodic or Au-Si eutectic bonding techniques. The dies sealed with anodic and Au-Si eutectic bonding provide a...
A NOVEL FABRICATION AND WAFER LEVEL HERMETIC SEALING METHOD FOR SOI-MEMS DEVICES USING SOI CAP WAFERS
Torunbalci, Mustafa Mert; Alper, Said Emre; Akın, Tayfun (2015-01-22)
This paper presents a novel and inherently simple all-silicon fabrication and hermetic packaging method developed for SOI-MEMS devices, enabling lead transfer using vertical feedthroughs formed on an SOI cap wafer. The processes of the SOI cap wafer and the SOI-MEMS wafer require a total of five inherently-simple mask steps, providing a combined process and packaging yield as high as 95%. The hermetic encapsulation is achieved by Au-Si eutectic bonding at 400 degrees C. The package pressure is measured as 1...
A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process
Torunbalci, Mustafa Mert; Alper, Said Emre; Akın, Tayfun (2014-09-10)
This paper presents a new method for wafer level vacuum packaging of MEMS devices using anodic bonding together with vertical feedthroughs formed on an SOI cap wafer, eliminating the need for any sealing material or any complex via-refill or trench-refill vertical feedthrough steps. The packaging yield is experimentally verified to be above 95%, and the cavity pressure is characterized to be as low as 1 mTorr with the help of a thin-film getter. The shear strength of several packages is measured to be above...
THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS
Torunbalci, M. M.; Alper, S. E.; Akın, Tayfun (2015-06-25)
This paper presents a novel, inherently simple and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where an SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a glass cap wafer is used for hermetic encapsulation and routing metallization. Glass-to-silicon anodically bonded seals yield a very stable cavity pressure of 150 mTorr after 15 days. The shear strength of the fabricated packages is above 7 MPa. Temperature cycling and u...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
L. Beker, O. Zorlu, and H. Külah, “A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION,” 2013, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/55368.