Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Open Access Guideline
Open Access Guideline
Postgraduate Thesis Guideline
Postgraduate Thesis Guideline
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
SELF-PACKAGED THREE AXIS CAPACITIVE MEMS ACCELEROMETER
Date
2020-01-01
Author
Aydemir, Akin
Akın, Tayfun
Metadata
Show full item record
This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
.
Item Usage Stats
198
views
0
downloads
Cite This
This paper presents the design, fabrication, and characterization of a self-packaged three axis capacitive MEMS accelerometer fabricated by using only four masks that is capable of differentially sensing the externally applied accelerations in three orthogonal axes. Individual lateral and vertical axis accelerometers are fabricated in the same die on a SOT wafer, which is eutectically bonded to a silicon substrate. Handle layer of the SOT wafer is both used as the top electrode for the vertical axis accelerometer, and a capping layer for all accelerometers. Vertical axis accelerometer has a 2 mm(2) perforated electrode area anchored to the Si substrate by four beams. The lateral axis accelerometers on the other hand, have comb finger structures with a 2.4 x 1.9 mm(2) device area and anchored to the Si substrate by four folded beams. Three axis accelerometer has a dimension of 8.45 x 4.0 x 0.84 mm(3). Rest capacitance of the vertical axis accelerometer is designed to be 12 pF, and it is 10 pF for the lateral axis accelerometers.
Subject Keywords
Capping
,
Self-Packaged
,
Out of plane accelerometer
,
SOT
,
Three-axis accelerometer
URI
https://hdl.handle.net/11511/57700
DOI
https://doi.org/10.1109/mems46641.2020.9056192
Conference Name
33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Collections
Department of Electrical and Electronics Engineering, Conference / Seminar
Suggestions
OpenMETU
Core
Process Development for the Fabrication of a Three Axes Capacitive MEMS Accelerometer
Aydemir, Akin; Akın, Tayfun (2015-09-09)
This paper presents a new approach for the fabrication of a three-axis capacitive MEMS accelerometer that is capable of differentially sensing the acceleration in all three orthogonal axes. For the first time in literature, differential sensing for the out of plane direction is achieved by defining a movable sensing electrode on the structural layer of the SOI wafer that is sandwiched between two stationary electrodes defined on the glass substrate and the handle layer of the SOI wafer enabling the differen...
A new design and a fabrication approach to realize a high performance three axes capacitive MEMS accelerometer
Aydemir, Akin; Terzioglu, Yunus; Akın, Tayfun (2016-06-15)
This paper presents a new fabrication approach and design for a three axis capacitive MEMS accelerometer that is capable of measuring externally applied accelerations in three orthogonal axes. Individual lateral and vertical axis accelerometers are fabricated in the same die on an SOI wafer which is anodically bonded to a glass substrate. Handle layer of the SOI wafer is used as the top electrode for the vertical axis accelerometer. This accelerometer has a 2 mm(2) perforated electrode area anchored to the ...
Fabrication of a Three-Axis Capacitive MEMS Accelerometer on a Single Substrate
Aydemir, Akin; Akın, Tayfun (2015-11-04)
This paper presents a new fabrication approach and a design for the fabrication of a three-axis capacitive MEMS accelerometer where differential sensing is enabled for all sense directions. In this approach, individual lateral and vertical axis accelerometers are fabricated in the same die on an SOI wafer which is eutectically bonded to a glass substrate. Differential sensing for the vertical axis accelerometer is realized by defining the proof mass of the accelerometer on the structural layer of the SOI wa...
A single mass two-axis capacitive MEMS accelerometer with force rebalance
Köse, Talha; Terzioʇlu, Yunus; Azgın, Kıvanç; Akın, Tayfun (2015-03-26)
This paper presents a single mass 2-axis MEMS capacitive accelerometer with a unique force rebalance method achieved with the readout circuit developed for the simultaneous 2-axis acceleration sensing. Using a single mass structure with extra fingers for reading multiple axes allows better sensor performances when compared to multi-axis accelerometers with individual proof masses occupying the same die area. Test results show 274 mV/g scale factor for x-axis, and 280 mV/g scale factor for y-axis, while the ...
Fabrication of A Sandwich Type Three Axis Capacitive MEMS Accelerometer
Tez, Serdar; Akın, Tayfun (2013-11-06)
This paper presents a three axis capacitive MEMS accelerometer including individual lateral and vertical accelerometers in a same die. The three axis capacitive MEMS accelerometer is fabricated by utilizing a glass-silicon-glass multi-stack formed by a fabrication process depending on the double glass modified silicon on glass process (DGM-SOG), where the structural layer is selected to be 35 mu m thick silicon. The fabrication process uses the Au-Si eutectic bonding in the last step of the formation of th...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
A. Aydemir and T. Akın, “SELF-PACKAGED THREE AXIS CAPACITIVE MEMS ACCELEROMETER,” presented at the 33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, CANADA, 2020, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/57700.
