Show/Hide Menu
Hide/Show Apps
Logout
Türkçe
Türkçe
Search
Search
Login
Login
OpenMETU
OpenMETU
About
About
Open Science Policy
Open Science Policy
Open Access Guideline
Open Access Guideline
Postgraduate Thesis Guideline
Postgraduate Thesis Guideline
Communities & Collections
Communities & Collections
Help
Help
Frequently Asked Questions
Frequently Asked Questions
Guides
Guides
Thesis submission
Thesis submission
MS without thesis term project submission
MS without thesis term project submission
Publication submission with DOI
Publication submission with DOI
Publication submission
Publication submission
Supporting Information
Supporting Information
General Information
General Information
Copyright, Embargo and License
Copyright, Embargo and License
Contact us
Contact us
Computer simulation of void growth dynamics under the action of electromigration and capillary forces in narrow thin interconnects
Date
2001-08-01
Author
Ogurtani, TO
Oren, EE
Metadata
Show full item record
This work is licensed under a
Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License
.
Item Usage Stats
169
views
0
downloads
Cite This
A comprehensive picture of void dynamics in connection with the critical morphological evolution has been developed in order to understand the conditions under which premature failure of metallic thin interconnects occurs. Our mathematical model on the mass flow and accumulation on void surfaces, under the action of applied electrostatic and elastostatic force fields, and capillary effects, follows an irreversible but discrete thermodynamic formulation of interphases and surfaces. This formalism also takes into account in a natural way the mass transfer process (the void growth), between bulk phase and the void region in multi-component systems, in terms of the normalized local values of Gibbs free energy of transformation with respect to the specific surface Gibbs free energy, in addition to the contribution due to local curvature of the advancing reaction front, rather rigorously. (C) 2001 American Institute of Physics.
Subject Keywords
Electromigration
,
Computer simulation
,
Mathematical modeling
,
Fluid flows
,
Electrostatics
,
Mass diffusivity
,
Interphases
,
Failure analysis
,
Capillary flows
URI
https://hdl.handle.net/11511/65267
Journal
JOURNAL OF APPLIED PHYSICS
DOI
https://doi.org/10.1063/1.1382835
Collections
Department of Metallurgical and Materials Engineering, Article
Suggestions
OpenMETU
Core
A computer simulation of void dynamics under the action of electromigration and capillary forces in narrow thin interconnects
Ogurtani, TO; Oren, EE (2000-10-25)
In these studies a comprehensive picture of void dynamics in connection with the critical morphological evaluation has been thoroughly anticipated in order to understand main reasons as well as the conditions under which premature failure of metallic thin interconnects occur. Our mathematical model on diffusion and mass accumulation on void surfaces, under the action of applied electrostatic potential and capillary effects, follows a novel irreversible but discrete thermodynamic formulation of interphases a...
Computer Solutions of Plane Strain Axisymmetric Thermomechanical Problems
Eraslan, Ahmet Nedim (2005-08-01)
A simple computational model is developed to estimate elastic, elastic-plastic, fully plastic, and residual stress states in generalized plane strain axisymmetric structures considering temperature dependent physical properties as well as nonlinear isotropic strain hardening. Using the von Mises yield criterion, total deformation theory and a Swift-type nonlinear hardening law, a single nonlinear differential equation governing thermoelastoplastic behavior is obtained. A shooting technique using Newton iter...
Numerical Simulation of Rarefied Laminar Flow past a Circular Cylinder
Çelenligil, Mehmet Cevdet (2014-07-18)
Numerical simulations have been obtained for two-dimensional laminar flows past a circular cylinder in the transitional regime. Computations are performed using the direct simulation Monte Carlo method for Knudsen numbers of 0.02 and 0.2 and Mach numbers of 0.102 and 0.4. For these conditions, Reynolds number ranges from 0.626 to 24.63 and the flows are steady. Results show that separation occurs in the wake region for the flow with Mach number of 0.4 and Knudsen number of 0.02, but for the other eases flow...
Computer Simulations on the grain boundary grooving and cathode edge displacement in bamboo-like metallic interconnects
Ogurtani, Tarik Omer; Akyildiz, Oncu (2006-04-21)
The process of grain boundary (GB) grooving and cathode edge displacement invoked by the surface drift-diffusion along the sidewalls in sandwich type thin film bamboo lines are simulated by introducing a new mathematical model. In the absence of the electric field, the computer studies on the triple junction kinetics show that it obeys the first order reaction kinetics at early transient stage, which is followed by the familiar time law as t(1/4), at the steady state regime. The applied electric field (EF) ...
Numerical simulation of scour at the rear side of a coastal revetment
Şentürk, Barış Ufuk; Guler, Hasan Gokhan; Baykal, Cüneyt (2023-05-01)
This paper presents the results of a numerical modeling study on the scouring of unprotected rear side material of a rubble mound coastal revetment due to the overtopping of solitary-like waves utilizing a coupled hydro-morphodynamic computational fluid dynamics (CFD) model. Three cases having various wave heights are tested with six different turbulence models together with different wall functions. The hydrodynamic results (free-surface elevations, overtopping volumes, and jet thicknesses) and morphologic...
Citation Formats
IEEE
ACM
APA
CHICAGO
MLA
BibTeX
T. Ogurtani and E. Oren, “Computer simulation of void growth dynamics under the action of electromigration and capillary forces in narrow thin interconnects,”
JOURNAL OF APPLIED PHYSICS
, pp. 1564–1572, 2001, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/65267.