A bulk-micromachined fully-differential MEMS accelerometer with interdigitated fingers

Date

2012-10-31

Author

Aydin, Osman
Akın, Tayfun

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

190
views

0
downloads

This paper proposes a novel bulk-micromachined MEMS accelerometer employing interdigitated sense fingers that provide a fully-differential (FD) signal interface, where the accelerometer can be fabricated by a modified Silicon-on-Glass (M-SOG) process utilizing a <;111>; Silicon-on-Insulator (SOI) wafer. The accelerometer combines the feasibility of fabricating large mass and high aspect ratio structures using bulk-micromachining together with the high sensitive interdigitated sense finger triplets that are connected with multi-layer metal interconnects on an SOI-glass bonded wafer. The fabricated accelerometer is packaged for system level tests with a 4 th order Σ-Δ readout circuitry to evaluate its performance. The measurement results show that the accelerometer achieves a bias instability of 66.1 μg and a velocity random walk of 17.5 μg/√Hz, while operating in a range of ±8 g.

Subject Keywords

Accelerometers, Capacitance, Metals, Glass, Thumb, Sensors

URI

https://hdl.handle.net/11511/40571

DOI

https://doi.org/10.1109/icsens.2012.6411038

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

Suggestions

OpenMETU
Core

A Bulk-Micromachined Fully Differential MEMS Accelerometer With Split Interdigitated Fingers Aydin, Osman; Akın, Tayfun (2013-08-01) This paper proposes a novel bulk-micromachined MEMS accelerometer employing split interdigitated sense fingers that provide a fully differential signal interface, where the accelerometer can be fabricated by a modified silicon-on-glass process using a silicon-on-insulator (SOI) wafer. The accelerometer combines the feasibility of fabricating large mass and high aspect ratio structures using bulk-micromachining together with the highly sensitive split interdigitated sense finger triplets that are connected w...
A Bulk-Micromachined Three-Axis Capacitive MEMS Accelerometer on a Single Die TEZ, SERDAR; Aykutlu, Ulas; Torunbalci, Mustafa Mert; Akın, Tayfun (2015-10-01) This paper presents a high-performance three-axis capacitive microelectromechanical system (MEMS) accelerometer implemented by fabricating individual lateral and vertical differential accelerometers in the same die. The fabrication process is based on the formation of a glass-silicon-glass multi-stack. First, a 35-mu m thick < 111 > silicon structural layer of an Silicon-On-Insulator (SOI) wafer is patterned with deep reactive ion etching (DRIE) and attached on a base glass substrate with anodic bonding, wh...
A symmetric surface micromachined gyroscope with decoupled oscillation modes Alper, Said Emre; Akın, Tayfun (2001-06-14) This paper reports a new symmetric gyroscope structure that allows not only matched resonant frequencies for the drive and sense vibration modes for better resolution, but also decoupled drive and sense oscillation modes for preventing unstable operation due to mechanical coupling. The symmetry and decoupling features are achieved at the same time with a new suspension beam design. The gyroscope structure is designed using a standard three-layer polysilicon surface micromachining process (MUMPs) and simulat...
A CMOS switched-capacitor interface circuit for an integrated accelerometer Külah, Haluk; Najafi, K (2000-01-01) This paper presents a CMOS interface electronics for monolithic micromachined capacitive accelerometer systems. The interface electronics is a fully differential switched-capacitor charge integrator with its internal clock generator and sensor feedback circuit for closed-loop operation. The circuit is designed for open-loop and closed-loop operations, and provides both digital and differential analog outputs. One of the main advantages of this chip is that it can be monolithically integrated with the sensor...
A simple out of plane capacitive MEMS accelerometer utilizing lateral and vertical electrodes for differential sensing Terzioglu, Yunus; Kose, Talha; Azgın, Kıvanç; Akın, Tayfun (2015-11-01) This paper presents an out-of-plane (z-axis) accelerometer, which incorporates the use of two different MEMS capacitive electrode structures in combination for implementing a linear closed-loop system. During the implementation, the complexity of the design and fabrication steps of the sensing element is kept at a minimum. The proposed accelerometer uses capacitive MEMS sensing element fabricated with a 4-mask process. This sensing element includes a comb finger type lateral electrode and a vertical paralle...

Citation Formats

O. Aydin and T. Akın, “A bulk-micromachined fully-differential MEMS accelerometer with interdigitated fingers,” 2012, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/40571.