A reconfigurable RF MEMS triple stub impedance matching network

Date

2006-09-12

Author

Unlu, M.
Topalli, K.
Atasoy, H.I.
Temocin, E.U.
Istanbulluoglu, I.
Bayraktar, O.
Demir, Şimşek
Civi, O.A.
Koç, Seyit Sencer
Akın, Tayfun

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

192
views

0
downloads

This paper presents a reconligurable triple stub impedance matching network using RF MEMS technology centered at 10GHz. The device is capable of covering impedances on the whole Smith Chart. The device structure consists of three variable length stubs which are designed as distributed MEMS transmission lines and two lambda(g)/8 length CPW transmission fines connecting the stubs. The variable length stubs are implemented with 12 MEMS switches over CPW lines and CPW lines connecting the switches. lambda(g)/8 spacing between the stubs is selected to obtain a uniform distribution of the impedance points on the Smith Chart. Initial measurement results of the fabricated structure show a good agreement with the simulation results.

Subject Keywords

Tuners, RF MEMS, MEMS Loaded Line, MEEMS Switch, Microwave Integrated Circuits

URI

https://hdl.handle.net/11511/47824

DOI

https://doi.org/10.1109/eumc.2006.281272

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

Suggestions

OpenMETU
Core

A fabrication process based on structural layer formation using Au-Au thermocompression bonding for RF MEMS capacitive switches and their performance Cetintepe, Cagri; Topalli, Ebru Sagiroglu; Demir, Şimşek; Aydın Çivi, Hatice Özlem; Akın, Tayfun (2014-10-01) This paper presents a radio frequency micro-electro-mechanical-systems (RF MEMS) fabrication process based on a stacked structural layer and Au-Au thermocompression bonding, and reports on the performance of a sample RF MEMS switch design implemented with this process. The structural layer consists of 0.1 mu m SiO2/0.2 mu m SixNy/1 mu m Cr-Au layers with a tensile stress less than 50 MPa deposited on a silicon handle wafer. The stacked layer is bonded to a base wafer where the transmission lines and the iso...
A New Temperature-Tolerant RF MEMS Switch Structure Design and Fabrication for Ka-Band Applications Demirel, Kaan; Yazgan, Erdem; Demir, Şimşek; Akın, Tayfun (2016-02-01) In this paper, the design and fabrication of a new radio frequency (RF) microelectromechanical system (MEMS) switch structure is presented. This RF MEMS switch is developed to get the minimum permanent deformation on the microbridge after 200 degrees C thermal treatment. The residual stress-based buckling on the MEMS bridge is simulated for 5-40-MPa/mu m stress gradient (Delta sigma) with 5-MPa/mu m steps. The temperature-dependent extension and deformation on the MEMS bridge are modeled up to 270 degrees C...
An adjustable impedance matching network using RF MEMS technology Ünlü, Mehmet; Demir, Şimşek; Akın, Tayfun; Department of Electrical and Electronics Engineering (2003) This thesis presents design, modeling, and fabrication of an RF MEMS adjustable impedance matching network. The device employs the basic triple stub matching technique for impedance matching. It has three adjustable length stubs which are implemented using capacitively loaded coplanar waveguides. The capacitive loading of the stubs are realized using the MEMS switches which are evenly distributed over the stubs. There are 40 MEMS bridges on each stub whichare separated with ?/40 spacing making a total of 12...
An Optimized Analog Drive-Mode Controller for Vibratory MEMS Gyroscopes Eminoglu, Burak; Alper, Said Emre; Akın, Tayfun (2011-09-07) This paper presents an optimized analytical design procedure for the drive mode analog controllers used in vibratory MEMS gyroscopes. The behaviour of the controller during start-up is analyzed in detail including the effect of the limited voltage swing of the controller circuitry. As a result, an optimum design procedure is developed for controller design, which is also experimentally verified in a practical implementation demonstrating a settling time of only 50msec without any overshoot, for a gyroscope ...
A Lorentz force MEMS magnetometer Pala, Sedat; Cicek, Meltem; Azgın, Kıvanç (2016-11-03) This paper presents a Lorentz force magnetometer with a MEMS resonator structure as a sensor. Magnetometer composed of a resonator and a grill structure. The grill structure reduces the heat generation due to the current required to generate the Lorentz force. The proposed sensor is produced with standard SOI micromachining processes with device layer thickness of 35 mu m. The natural frequency of resonator is around 83 kHz, Q-factor of 1870 at around 40 mTorr ambient pressure. Tests are done for 1.12 mT ma...

Citation Formats

M. Unlu et al., “A reconfigurable RF MEMS triple stub impedance matching network,” 2006, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/47824.