A Novel Method for Fabricating MEMS Three-Axis Accelerometers using Low Temperature Au-Sn Eutectic Bonding

Date

2016-11-03

Author

Tez, Serdar
Torunbalci, Mustafa Mert
Akın, Tayfun

Metadata

Show full item record

This work is licensed under a Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Item Usage Stats

142
views

0
downloads

This paper presents a novel method for the fabrication of three-axis capacitive MEMS accelerometers by using low-temperature Au-Sn eutectic bonding that is applied to form a glass-silicon-glass multi-stack. The proposed method provides the implementation of individual in-plane and out-of-plane accelerometer elements in the same die using a glass-silicon-glass multi-stack structure formed at temperatures as low as 300 degrees C while still ensuring the advantages of the previous approaches such as the voltage free bonding, inherent capping, and the differential sensing. The initial prototypes are verified to be functional and mechanically strong (>9.5MPa) by C-V measurements and shear strength tests.

Subject Keywords

MEMS three-axis accelerometer, Glass-silicon-glass multi-stack, Gold-Tin eutectic bonding

URI

https://hdl.handle.net/11511/52738

Collections

Department of Electrical and Electronics Engineering, Conference / Seminar

Suggestions

OpenMETU
Core

A Bulk-Micromachined Three-Axis Capacitive MEMS Accelerometer on a Single Die TEZ, SERDAR; Aykutlu, Ulas; Torunbalci, Mustafa Mert; Akın, Tayfun (2015-10-01) This paper presents a high-performance three-axis capacitive microelectromechanical system (MEMS) accelerometer implemented by fabricating individual lateral and vertical differential accelerometers in the same die. The fabrication process is based on the formation of a glass-silicon-glass multi-stack. First, a 35-mu m thick < 111 > silicon structural layer of an Silicon-On-Insulator (SOI) wafer is patterned with deep reactive ion etching (DRIE) and attached on a base glass substrate with anodic bonding, wh...
A method and electrical model for the anodic bonding of SOI and glass wafers Tatar, E.; Torunbalci, M.M.; Alper, S.E.; Akın, Tayfun (2012-02-02) This paper provides a method for the anodic bonding of SOI and glass wafers, and it explains the bonding mechanism with an electrical model, for the first time in the literature. SOI-glass anodic bonding can be achieved at voltages as low as 250V similar to Si-glass anodic bonding, and the underlying principles can be understood by modeling the overall system with a series-connected capacitor-resistor network. The SOI-oxide layer can be added as a capacitor to the classical anodic bonding model, and the beh...
A PARYLENE BONDING BASED FABRICATION METHOD FOR GRAVIMETRIC RESONANT BASED MASS SENSORS Gokce, Furkan; Aydın, Eren; Kangül, Mustafa; Toral, Taylan B.; Zorlu, Ozge; Sardan-Sukas, Ozlem; Külah, Haluk (2017-06-22) In this study, a fabrication method utilizing parylene bonding for gravimetric resonant based mass sensors is presented. First, parylene bonding was experimentally tested and compared with the literature. Average shear strength was measured as 16.3 MPa (sigma=3MPa). Then, resonators located on top of a microchannel for real-time detection were fabricated using the presented method. Simulations and experiments verify proper operation of the fabricated resonators, and the applicability of the method for fabri...
A low-power robust humidity sensor in a standard CMOS process Okcan, Burak; Akın, Tayfun (2007-11-01) This paper presents a low-cost thermal-conductivity-based humidity sensor implemented using a 0.6-mu m CMOS process, where suspended p-n junction diodes are used as the humidity-sensitive elements. The measurement method uses the difference between the thermal conductivities of air and water vapor at high temperatures by comparing the output voltages of two hea ted and thermally isolated diodes; one of which is exposed to the environment and has a humidity-dependent thermal conductance, while the other is s...
A Novel Characterization Method for MEMS Based Electrostatic Resonators for Q Enhancement and Feedthrough Current Elimination AYDIN GÖL, EBRU; Kangul, M.; Gökce, Fuat; Zorlu, O.; Külah, Haluk (2016-11-03) This paper introduces a new technique for electrostatic resonance characterization based on 2nd harmonic distortion terms at the output current. Mathematical analysis of the output current shows that the 2nd harmonic component exhibits higher quality factor (Q) than the 1st harmonic. Besides, output current to feedthrough current ratio is higher in the 2nd harmonic term. Experimental results show that the Q of the resonating system is enhanced by 66% with 2nd harmonic operation. Moreover, the resonance peak...

Citation Formats

S. Tez, M. M. Torunbalci, and T. Akın, “A Novel Method for Fabricating MEMS Three-Axis Accelerometers using Low Temperature Au-Sn Eutectic Bonding,” 2016, Accessed: 00, 2020. [Online]. Available: https://hdl.handle.net/11511/52738.